Printed Circuit Board Assemblies (PCBA)

The majority of the PCBAs produced by Season Group are used in assembling complete electromechanical products within Season Group's locations.

    We are geared to providing customers with production capabilities in:
  • Low-volume prototyping
  • Low-volume, high-mix
  • Medium Volume, medium mix
  • Higher volume, medium mix
Printed Circuit Board Assemblies (PCBA)

The SMT equipment that we use is ideally suited to support high and medium mix business and is capable of placing the most complex of components including Package on Package (POP), BGAs (up to 784 balls with a minimum ball diameter 0.25mm a minimum pitch of 0.4 mm)

Due to the breadth of end customer markets that we serve, we are also experienced in producing PCBAs on a variety of substrates including FR4, CEM1, CEM3, Phenolic, Polyimide, Aluminum substrate. Season has dedicated SMT, PTH and Mixed Technology production lines – as well as dedicated RoHS lines per IPC standards.

    In order to ensure the quality of output from PCBA (often onto our own Electromechanical Assembly lines) we have the following additional processes :
  • Automatic Optical Inspection (AOI)
  • In-Circuit Testing (ICT)
  • Manual X-Ray Inspection
  • Functional Test inspection
  • Module or Subsystem Assembly and Test